Bond-1 Primer/Adhesive, 5th Generation Total-Etch Bonding System, 4 mL Bottle, N01IAA
Bond-1 Primer/Adhesive is a 5th generation total-etch bonding system supplied in a convenient single 4 mL bottle. It provides high bond strengths of up to 31 MPa to dentin and 27 MPa to enamel with a low film thickness of only 8 µm, and bonds to light- or chemical-cured composites, porcelains, metal restorations, and amalgam. The one-step, no-priming application technique works for both direct and indirect restorations and helps eliminate post-operative sensitivity.
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Bond-1 Primer/Adhesive is a 5th generation total-etch bonding system supplied in a convenient single 4 mL bottle. It provides high bond strengths of up to 31 MPa to dentin and 27 MPa to enamel with a low film thickness of only 8 µm, and bonds to light- or chemical-cured composites, porcelains, metal restorations, and amalgam. The one-step, no-priming application technique works for both direct and indirect restorations and helps eliminate post-operative sensitivity.
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